Product
Build-Up/BVH
Flexible/Rigid-Flexible
Silver Through Hole
Metal Based
Heavy Copper
Memory Module
Technology
Special Technology
 
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Build-Up/BVH

Specifications
Material FR-4, RCC
Layer 8
Thickness 0.8t
Structure 2+4+2 (PTH+BVH+L-BVH)
Finish OSP,ENIG,
Application Mobile, Bluetooth
Digital Camera,Camcorder
PDA, R/F Module

Build-up Construction:2+4+2

Construction
Item Mark 2005(Current) 2006 2007
Min. Line Width A 75㎛ 50㎛ 30㎛
Min. Line Space B 75㎛ 50㎛ 30㎛
Min. Laser Drill C 0.075Φ(75㎛) 0.06Φ(60㎛) 0.05Φ(50㎛)
Min. Laser Land (Outer/Inner) D 250 ㎛ / 300㎛
200 ㎛ / 250㎛ 150 ㎛ / 200㎛
Min. Mechanical Drill E 0.15Φ(150㎛)
0.10Φ(100㎛) -
Min. Mechanical Land (Outer/Inner) F 300 ㎛ / 350㎛ 250 ㎛ / 300㎛ -
Min. Copper Thickness G 12㎛ 9㎛ 6㎛
Min. Dielectric Thickness H 60㎛ 40㎛ 30㎛
Note.Mass Production  

Design Rule of MICRO Via
Build-up Construction:3+2+3
  Artwork Design Rule Normal Special
A Line Width 75㎛ 65㎛
B Line Space 75㎛ 65㎛
C Laser Via Hole 100㎛ 75㎛
D Laser Via Land 300㎛ 250㎛
F PTH Drill 200㎛ 150㎛
G PTH Land 400㎛ 350㎛
H Buried Via Hole 200㎛ 150㎛
I Buried Via Land 400㎛ 350㎛
MICRO Via Stack
Build-up Construction:3+2+3
A B C D
250㎛ 150㎛ 50㎛ 100㎛
 
 
     
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Tel : 82-31-495-8064 / Fax : 82-31-495-8065