PCB Division
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Product
| Home > PCB > Product > Build-Up/BVH |
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 Specifications
| Material |
FR-4, RCC |
| Layer |
8 |
| Thickness |
0.8t |
| Structure |
2+4+2 (PTH+BVH+L-BVH) |
| Finish |
OSP,ENIG, |
| Application |
Mobile, Bluetooth
Digital Camera,Camcorder
PDA, R/F Module |
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Build-up Construction:2+4+2 |
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 Construction |
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| Item |
Mark |
2005(Current) |
2006 |
2007 |
| Min. Line Width |
A |
75㎛ |
50㎛ |
30㎛ |
| Min. Line Space |
B |
75㎛ |
50㎛ |
30㎛ |
| Min. Laser Drill |
C |
0.075Φ(75㎛) |
0.06Φ(60㎛) |
0.05Φ(50㎛) |
| Min. Laser Land (Outer/Inner) |
D |
250 ㎛ / 300㎛
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200 ㎛ / 250㎛ |
150 ㎛ / 200㎛ |
| Min. Mechanical Drill |
E |
0.15Φ(150㎛)
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0.10Φ(100㎛) |
- |
| Min. Mechanical Land (Outer/Inner) |
F |
300 ㎛ / 350㎛ |
250 ㎛ / 300㎛ |
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| Min. Copper Thickness |
G |
12㎛ |
9㎛ |
6㎛ |
| Min. Dielectric Thickness |
H |
60㎛ |
40㎛ |
30㎛ |
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| Note.Mass Production |
| Design Rule of MICRO Via |
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| Build-up Construction:3+2+3 |
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Artwork Design Rule |
Normal |
Special |
| A |
Line Width |
75㎛ |
65㎛ |
| B |
Line Space |
75㎛ |
65㎛ |
| C |
Laser Via Hole |
100㎛ |
75㎛ |
| D |
Laser Via Land |
300㎛ |
250㎛ |
| F |
PTH Drill |
200㎛ |
150㎛ |
| G |
PTH Land |
400㎛ |
350㎛ |
| H |
Buried Via Hole |
200㎛ |
150㎛ |
| I |
Buried Via Land |
400㎛ |
350㎛ |
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| MICRO Via Stack |
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| Build-up Construction:3+2+3 |
| A |
B |
C |
D |
| 250㎛ |
150㎛ |
50㎛ |
100㎛ |
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