Product
Build-Up/BVH
Flexible/Rigid-Flexible
Silver Through Hole
Metal Based
Heavy Copper
Memory Module
Technology
Special Technology
 
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Rigid-Flexible(Build-Up)

Specifications
Material RCC,FR-4, Capton,Apical
Layer 6
Thickness 1.2T
Line/Space 50㎛~40㎛
Min.Hole 0.1Φ
Finish OSP,ENIG,
Application Mobile, Bluetooth
Digital Camera,Camcorder
PDA, Medical Device

Construction
 
 
     
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