Product
Build-Up/BVH
Flexible/Rigid-Flexible
Silver Through Hole
Metal Based
Heavy Copper
Memory Module
Technology
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Memory Module

  DIMM
Specifications
Material Hi-Tg FR-4
Layer 8L
Thickness 1.27T ±0.1
Line/Space 100㎛/100㎛
Min.Hole 0.2Φ
Finish ENIG,Hard Gold
Impedance 60Ω±10%
Package FBGA (DDR 2)
Frequency 1 GHz
Application Desk Top Computer
Notebook Computer
  SO-DIMM
Specifications
Material Hi-Tg FR-4
Layer 6L
Thickness 1.0T ±0.1
Line/Space 100㎛/100㎛
Min.Hole 0.2Φ
Finish ENIG,Hard Gold
Impedance 60Ω±10%
Package FBGA (DDR 2)
Frequency 1 GHz
Application Desk Top Computer
Notebook Computer


 
     
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