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HPL: HOLE PLUGGING LAND
What is ; HPL is VIA ON PAD technique, forming via hole under SMD pad.

HPL feature by structure
Structure Feature Paste
PTH& Surface plating Non-conductive or radiation
(1.8 ~ 3.0 W/m.k)
PTH plating ellipsis Conductive or radiation
(1.8 ~ 3.0 W/m.k)
1.2th plating ellipsis, Solderablity Conductive or Conductive solder radiation
(1.8 ~ 3.0 W/m.k)
Non-solderability Non-conductive or radiation
(0.8 ~ 2.0 W/m.k)
   
Effect
Prevent solder bridging between closely spaced holes
Eliminate solder flow up via holes during assembly
Maximize thermal and electrical conductivity with thermally conductive paste
Minimize flux residues and contamination
Minimize PCB size and layers
Easier to Draw a wiring diagram than normal PTH
Prevent micro-chip from slanting while soldering


 
     
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