TGFR is the technique and process for filling the conductor spaces, which copper thickness is over 5oz, with special resin.
Excellent withstanding voltage and insulation between tracks
Effect on keeping thermal balance on PCB surface while it’s operating
Increase thermal effects for bare boards & surface mounted components
Secure reliability in insulation at operating condition like high temperature and humidity
Prevent soldering short & contamination while assembling
Reduce bow & twist of PCB and defect rate in assembling process by filling conductor space
Diminish heavy copper PCB weight & size by thinner insulation layer.
Diminish PCB layer
Reduce thickness of dielectric layers for multi-copper thickness PCB
HICH CURRENT PRODUCT
Copyright 2013 TECHNICOM CO.,LTD. All rights reserved.
Address : B-421, 540, Misa-daero, Hanam-si, Gyeonggi-do, Korea (12925)