PCB Division
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Technology
| Home > PCB > Technology > Technical Road Map |
 Technical Road Map |
| Item |
2005 |
2006 |
| Line Space |
Inner/mil
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50㎛/50㎛ |
40㎛/40㎛ |
| Outer/mil |
60㎛/60㎛ |
50㎛/50㎛ |
| Mechanical Drill |
Min. Hole Size |
150㎛ |
100㎛ |
| Land Size |
350㎛ |
300㎛ |
| Aspect Ratio |
12.0 |
14.0 |
| Laser Drill |
Min. Hole Size |
100㎛ |
75㎛ |
| Land Size |
300㎛ |
250㎛ |
| Impedance Tolerance |
Inner |
8.0% |
5.0% |
| Outer |
8.0% |
5.0% |
| Cu Plating |
Throwing Power |
85% |
90% |
| Finish |
Lead Free HAL,,OSP,Immersion Tin,Selective OSP,Gold Plating(ENIG,Hard,Soft) |
| Others |
Embedded Passive |
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